... Not too bad of a soldering job for a newb at it ... lol ... that should work just fine.
Words of advise on future soldering work though:
Solder is NOT melted upon the wire or the pad as was obviously the case by looking at two of your solder pads.
The tip of the soldering iron should contact the place where the wire meets the pad in such a way that BOTH the solder pad AND the wire are heated simultaneously
to the point at which they melt the solder when it's touched to THEM (not to the tip of the iron). The solder will then flow over the entire pad uniformly and create a "fillet"
which rises from the edges of the pad up to and around the wire.
If the pad is not hot enough it will look like "a drop" of solder sitting atop the pad (like your "S4 pos and neg" connections) but all the other connections look really good.
In fact, the connections I'm critical of are
good enough too, so I wouldn't mess with them again. If the pad is hot enough but the wire is not, then the pad will be covered
well but the solder will "pucker" around the wire rather than flowing up onto it. The connection being "shiny" is proof that the solder was clean (no contaminants or slag)
and that the solder was not overheated.
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